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Weekly Lasers Wrap-Up: Week of October 17, 2016

  • October 21st, 2016

The Laser Institute of America Weekly Lasers Wrap-Up is an aggregation of all that you may have missed this week in the world of lasers. From Industry news to Conference updates and LIA happenings, here’s what happened during ICALEO Week 2016: 

LIA Happenings & Updates
This week brought us the 35th ICALEO® in San Diego, California. The LIA Twitter page is filled with updates, photos, and featured tweets from the event. Follow @laserinstitute on Twitter to see what you may have missed at this year’s event.

Be sure to download our latest trend report The Future of Laser Technology Manufacturing. As an increasing […]

Laser Weld Process Monitoring: Seeing the Unseeable

  • October 20th, 2016

By Christopher M. Galbraith and Paul J.L. Webster

The economic case for using lasers in industrial welding applications is no longer in question. Industrial lasers provide massive leverage in the form of an unmatched combination of speed, precision, robustness and—increasingly—accessibility. In serial production they can provide time and cost savings, and enable more efficient product designs. The price per kilowatt of laser power has dropped steeply in recent years, and in combination with a growing market and increasing number of players supplying laser solutions, this has led to increasing commoditization of laser sources and systems. In the quest to gain […]

The Magic of Nonlinear Laser Processing: Shaping Multi-Functional Lab-in-Fiber

  • October 18th, 2016

By Moez Haque and Peter R. Herman

The manipulation of femtosecond laser light inside transparent media can be directed on varying interaction pathways of micro-explosions, photochemistry and self-focusing filamentation to open new directions in creating dense memory storage, three-dimensional (3D) optical circuits, 3D microfluidic networks, and high-speed scribing tracks[1-3]. Our group has been following these fundamental and nonlinear interactions to control femtosecond laser processes in transparent coreless and single-mode optical fibers (SMFs) and thereby form highly functional and compact fiber devices that may seamlessly integrate with microelectronic chips. Such optical fibers are currently deployed over a billion kilometers of worldwide […]

Weekly Lasers Wrap-Up: Week of October 10, 2016

  • October 14th, 2016

Bringing you up to date with the latest in laser news, LIA updates, and industry conferences, the LIA Weekly Lasers Wrap-Up provides a brief rundown of what you may have missed this week. Take a peek below: 

Conference News

With ICALEO® just days away, an in-depth look at this year’s sessions and offerings is available on Lasers Today and in the latest issue of LIA Today. Discover the hot topics that will be covered as well as some tidbits from presenters, themselves! Find it here.

Still need to register for ICALEO®, taking place October 16–20, 2016 in San Diego, California? Check the […]

Laser Institute of America Announces Launch of Official ICALEO App

  • October 14th, 2016

LIA’s new app provides complete ICALEO resources and opportunities in a single, user-friendly platform

ORLANDO, FL – OCTOBER 14, 2016 – Laser Institute of America announces today the launch of the official International Congress on Applications of Lasers and Electro-Optics (ICALEO®) App. Created as a full-service companion to the world’s premier platform for breakthrough laser solutions, the new app, published by Omnipress, provides a variety of solutions for this year’s ICALEO attendees, including a schedule with itinerary builder and note-taking capabilities, an activity stream with social timeline, a lineup of speakers, as well as a GPS-enabled […]

A New Method of Laser Shock Peening

  • October 14th, 2016

By Yujie Xu, WenWu Zhang, Zhenying Du and Liang Ruan

Laser shock peening (LSP) is a surface strengthening technology. Compared with traditional surface treatment technologies (i.e., shot peening), it has many advantages such as non-contact, no heat-affected zone, good controllability and significant strengthening effect.

The mechanism of LSP is shown in Figure 1. In this process, a short-pulse (tens of nanoseconds) and high power (in the magnitude of 109 W) laser spot passes through the transparent confinement layer and acts on the surface of the coated absorption layer. After absorbing the laser energy, the absorption layer evaporates rapidly, and the dense […]

October’s Featured Corporate Member – Buffalo Filter LLC

  • October 13th, 2016

A market leader, Buffalo Filter LLC, located in Lancaster, NY, produces technologies and solutions that are used to manage the hazards associated with surgical plume inhalation. Dedicated to eliminating the plumes, which contain harmful gases, respirable particles and biological matter that can transfer disease, Buffalo Filter works diligently to protect the individuals who care for others in surgical settings.

Though now a wholly-owned business unit of the Texas-based Filtration Group, Buffalo Filter originally began in 1991 as a small, privately-owned company in Buffalo, NY, manufacturing its own brand of filters and smoke evacuation systems. When the Filtration Group acquired the […]


  • October 12th, 2016

It Can Only Be Done with Lasers
By Debbie Sniderman

From stars to phones, smart payment cards to medical implantable materials, lasers are reaching into more areas where traditional machining and processing methods don’t offer much needed precision, accuracy or sensitivity. LIA’s 35th International Congress on Applications of Lasers & Electro-Optics (ICALEO®) is the premier conference focusing on the research and scientific aspects of materials processing with lasers where attendees can learn about the latest developments and network with others.

This year’s conference will be held on Oct. 16-20 in San Diego and attendance is expected to be one of the best. […]

New Laser-Assisted Doping Process Extends Functionality of Ultra-Thin TMDCs

  • October 7th, 2016

By Debbie Sniderman

A new class of semiconducting materials, 2D transition metal dichalcogenides (TMDCs), have exceptional optoelectronic characteristics and can be made ultra-thin. When reduced to a few or mono-layers, they have the potential to meet the small size, high mechanical stability and low power requirements, and be integrated into flexible electronics and used as an alternative material to conventional silicon-based electronic devices.

TMDCs are inorganic semiconductors that have a transition metal and one other element with the chemical formula MX2 (M=Mo, W; X=S, Se, Te). Their relatively large bandgap, fast response and ability to absorb light makes them interesting for […]

Tailoring Bessel Beams to Form High Aspect Ratio Vias in Silicon

By Debbie Sniderman

Fabricating through-silicon vias (TSVs) is a key processing technology for 3D silicon IC integration and assembly. These deep holes allow chips to be connected electrically in vertical orientations, completely passing through the entire thickness of silicon wafers, creating 3D ICs for many applications such as image sensors and DRAMS.

Dr. Koji Sugioka’s research team at the RIKEN Center for Advanced Photonics in Japan along with collaborators at the Shanghai Institute Shanghai Institute of Optics and Fine Mechanics in China developed a new laser ablation technology for fabricating high aspect ratio vias using tailored femtosecond Bessel beams.

Maintaining Focus
Bessel beams […]

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