Tailoring Bessel Beams to Form High Aspect Ratio Vias in Silicon

By Debbie Sniderman Fabricating through-silicon vias (TSVs) is a key processing technology for 3D silicon IC integration and assembly. These deep holes allow chips to be connected electrically in vertical orientations, completely passing through the entire thickness of silicon wafers, creating 3D ICs for many applications such as image sensors and DRAMS. Dr. Koji Sugioka’s […]

Read more