Laser Joining for Packaging in MEMS Applications and Micro-Devices

By: Norbert Lorenz In recent years the interest in micro-devices, including Micro-Electro-Mechanical-Systems (MEMS), from research institutions, industry and the press has risen considerably. However one of the persisting challenges in the fabrication of such devices is the packaging process. A number of different bonding techniques have been developed but in general they require the entire […]

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Electrical-Mechanical-Systems

By: Norbert Lorenz Over the past few years the interest in Micro-Electro-Mechanical-Systems (MEMS) and Micro-Optical-Electrical-Mechanical-Systems (MOEMS) from research institutions, industrial firms and the press has risen considerably. Of particular interest are lab-on-a chip devices where many subsystems (ICs and MEMS) are assembled to a functional system for medical and bio-photonic applications. To date the main […]

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