September’s Featured Corporate Member – Wayne Trail, A Lincoln Electric Company

Wayne Trail, a subsidiary of Lincoln Electric, is a leader in the design of flexible, automated systems utilized within a wide range of metal forming, fabricating and joining industries. Its current market segments include robotics, welding and fixturing; press automation; tube bending and fabricating systems; tubular hydroform and structural frame automation; build-to-print manufacturing services; and […]

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Drilling of Cooling Holes by Using High-Power Ultrashort Pulsed Laser Radiation

By Hermann Uchtmann One of the main applications for laser drilling is the manufacturing of cooling holes with diameters of e.g., 500 µm in turbine components such as turbine blades and vanes or combustion chambers. Nowadays, these cooling holes are drilled by using flash lamp pumped Nd:YAG laser radiation and partially by using QCW fiber laser […]

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The Novel Technology for Thick Glass Cutting with Small Power Laser Saw

By Chao Huang, Jimin Chen and Shi bai Introduction In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However the glass cutting is always a difficulty because of its fracture characteristics. Especially in the field of irregular curve cutting, sloped cutting and drilling. In […]

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Real-Time Control of Polarization in High-Aspect-Ratio Ultra-Short-Pulse Laser Micro-Machining

By: O. J. Allegre, W. Perrie, K. Bauchert, G. Dearden, K. G. Watkins Laser Group, School of Engineering, University of Liverpool, UK Boulder Nonlinear Systems, Inc., Colorado The past decade has seen the development of ultra-short pulse lasers, with processes based on femtosecond and picosecond pulse durations becoming increasingly widespread. Thanks to the ultra-short timescale on […]

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The Percussion Drilling of SI using a 20W MOPA Based YB Fiber Laser

By: Kun Li, William O’Neill, Jack Gabzdyl Institute for Manufacturing, University of Cambridge SPI Lasers The micro-machining of silicon components for use in the MEMS fabrication and microelectronics industry is well-established, and the demand for semiconductors started to recover after the 2008 downturn. Laser micro-drilled interconnect via holes is an application that has been applied […]

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