High Density Through Glass Vias for Advanced Chip Packaging

By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative […]

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