High Density Through Glass Vias for Advanced Chip Packaging

By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below shows attractive cost and superior high frequency performance relative […]

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Femtosecond Laser Micromachining of Fused Silica for Microfluidic and Micro-Optical Applications

By: Ya Cheng, Fei He, Yang Liao, Lingling Qiao, Zhizhan Xu, Koji Sugioka and Katsumi Midorikawa State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, China Laser Technology Laboratory, RIKEN – Advanced Science Institute, Japan Nowadays, microfluidic systems for controlling and manipulating tiny volumes of liquids with high precision have attracted […]

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Atomistic Structure and Dynamic Evolution of Shock Waves in Laser-material Interaction

By: Xinwei Wang Department of Mechanical Engineering, Iowa State University This work reports on the pioneering molecular dynamics (MD) modeling of shock waves in laser-material processing. For pulsed laser-assisted material processing with an ambient gas, the fast melting, vaporization, and phase explosion of the target is a very complicated process and will form a strong […]

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Laser Joining for Packaging in MEMS Applications and Micro-Devices

By: Norbert Lorenz In recent years the interest in micro-devices, including Micro-Electro-Mechanical-Systems (MEMS), from research institutions, industry and the press has risen considerably. However one of the persisting challenges in the fabrication of such devices is the packaging process. A number of different bonding techniques have been developed but in general they require the entire […]

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Microdrilling of Sheet Materials with Femtosecond Laser Pulse Shaped by Computer Generated Hologram

By: Hayato Kawashima, Masahiro Yamaji, Jun’ichi Suzuki, Shuhei Tanaka We have developed a three-dimensional (3D) femtosecond laser processing method using a computer generated hologram (CGH) that generates a 3D structure inside transparent materials. Since 3D structure can be formed simultaneously with femtosecond laser pulses shaped by a CGH, our method is high efficient, and it […]

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