Carving Extremely Hard and Brittle Material with a Laser Beam

By: Dr. Lim Gnian Cher Laser is a potential tool for machining structural profiles on hard and brittle materials such as ceramics and carbides that traditional tools and methods find them near impossible to do.  EDM (electro-discharge machining) may be used for substrates that are conductive, such as tungsten carbide.  However, drilling small holes or […]

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Micro-Hole Drilling on Cemented Tungsten Carbide by Ultra Short Laser Pulses

By: Khai Pham Xuan, Kazuya Saginawa, Rie Tanabe, Yoshiro Ito Department of Mechanical Engineering, Nagaoka University of Technology Recently, high precision molds for small products are being highly required in many industrial applications, especially in information communication technology. Mold materials with high hardness, such like cemented tungsten carbide (WC-Co), are difficult to machine by classical […]

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The Percussion Drilling of SI using a 20W MOPA Based YB Fiber Laser

By: Kun Li, William O’Neill, Jack Gabzdyl Institute for Manufacturing, University of Cambridge SPI Lasers The micro-machining of silicon components for use in the MEMS fabrication and microelectronics industry is well-established, and the demand for semiconductors started to recover after the 2008 downturn. Laser micro-drilled interconnect via holes is an application that has been applied […]

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