The Novel Technology for Thick Glass Cutting with Small Power Laser Saw

By Chao Huang, Jimin Chen and Shi bai Introduction In recent years, glass has been widely used in different industrial field due to its excellent physical and chemical properties. However […]

High Density Through Glass Vias for Advanced Chip Packaging

By Ralph Delmdahl, Rainer Pätzel, Rolf Senczuk and Jan Brune Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging […]